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New adhesion promoters for copper leadframes and epoxy resin

Müller, Rainer and Heckmann, Klaus and Habermann, M. and Paul, T. and Stratmann, M. (2000) New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65-83.

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Abstract

New primer mols. have been synthesized to increase the adhesion strength between a copper leadframe and an epoxy molding compd. in microelectronical devices. The coupling agents were preliminarily chemisorbed at the surface of copper plates via special binding groups like thiol, disulfide, ethylene diamine and phthalocyanine. Binding to the epoxy resin was performed via an hydroxyl group. ...

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Item Type:Article
Date:2000
Institutions:Chemistry and Pharmacy > Institut für Physikalische und Theoretische Chemie > Chair of Chemistry VI - Physical Chemistry (Solution Chemistry) > Prof. Dr. Werner Kunz
Identification Number:
ValueType
10.1080/00218460008029268DOI
Keywords:disulfide ethylene diamine phthalocyanine coupling agent silicon chip copper leadframe epoxy adhesion promoter
Subjects:500 Science > 540 Chemistry & allied sciences
Status:Published
Refereed:Yes, this version has been refereed
Created at the University of Regensburg:Yes
Owner: Georg Berger
Deposited On:19 Jun 2012 05:58
Last Modified:19 Jun 2012 05:58
Item ID:24968
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