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Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy

Hanekamp, Patrick, Robl, Werner and Matysik, Frank-Michael (2017) Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy. Journal of Applied Electrochemistry 47 (12), pp. 1305-1312.

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Other URL: http://doi.org/10.1007/s10800-017-1124-8


Abstract

In this report, a versatile experimental concept for electrochemical deposition and subsequent surface characterization studies is presented. This concept can be utilized to perform semiconductor plating processes at laboratory scale followed by scanning electrochemical microscopy (SECM). The same sample holder used for electroplating experiments could be integrated into the SECM instrument. ...

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Item type:Article
Date:2017
Institutions:Chemistry and Pharmacy > Institut für Analytische Chemie, Chemo- und Biosensorik
Chemistry and Pharmacy > Institut für Analytische Chemie, Chemo- und Biosensorik > Instrumentelle Analytik (Prof. Frank-Michael Matysik)
Identification Number:
ValueType
10.1007/s10800-017-1124-8DOI
Keywords:DIRECT COPPER ELECTRODEPOSITION; DIFFUSION BARRIER; LINER MATERIALS; NUCLEATION; SECM; CU; INTERCONNECTS; DEPOSITION; CORROSION; GROWTH; Scanning electrochemical microscopy; Electrodeposition; Copper; Nucleation; Semiprecious thin-film material
Dewey Decimal Classification:500 Science > 540 Chemistry & allied sciences
Status:Published
Refereed:Yes, this version has been refereed
Created at the University of Regensburg:Yes
Item ID:39539
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