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Development and application of an experimental concept for surface characterization of semiconductor based substrates using scanning electrochemical microscopy

URN to cite this document:
urn:nbn:de:bvb:355-epub-400595
DOI to cite this document:
10.5283/epub.40059
Hanekamp, Patrick
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License: Creative Commons Attribution 4.0
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Date of publication of this fulltext: 16 Mar 2020 08:01


Abstract (English)

In this work, evaluation of the applicability of electrochemical scanning microscopy (SECM) for semiconductor industry-relevant thin film materials was carried out. These investigations were focused on the local electrochemical characterization of electrodeposited copper layers and their growth behavior on a variety of barrier materials such as Pt, Ru, TiN, TaN, Ta, Ti, W, and TiW. A special ...

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Translation of the abstract (German)

Im Rahmen dieser Arbeit wurden die Analysemöglichkeiten von relevanten Materialien aus der Halbleiterindustrie mittels elektrochemischer Rastermikroskopie (SECM) evaluiert. Im Fokus dieser Untersuchungen stand die lokale Oberflächencharakterisierung von elektrochemisch abgeschiedenen Kupferschichten und deren Wachstumsverhalten auf unterschiedlichen Barrierematerialien (Direct Copper Plating, ...

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