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Publications by Albert, P.

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Schaffus, T., Albert, P., Breuer, W., Debie, D., Graml, M., Hollerith, C., Kroninger, F., Mack, W., Pfaff, H., Schaffus, M. and Walter, J. (2018) Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation. Microelectronics Reliability 88-90, pp. 299-303. Fulltext not available.

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