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New adhesion promoters for copper leadframes and epoxy resin
Müller, Rainer, Heckmann, Klaus, Habermann, M., Paul, T. and Stratmann, M. (2000) New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65-83.Date of publication of this fulltext: 19 Jun 2012 05:58
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| Item type | Article | ||||
| Journal or Publication Title | Journal of Adhesion | ||||
| Publisher: | Gordon & Breach Science | ||||
|---|---|---|---|---|---|
| Volume: | 72 | ||||
| Number of Issue or Book Chapter: | 1 | ||||
| Page Range: | pp. 65-83 | ||||
| Date | 2000 | ||||
| Institutions | Chemistry and Pharmacy > Institut für Physikalische und Theoretische Chemie > Chair of Chemistry VI - Physical Chemistry (Solution Chemistry) > Prof. Dr. Werner Kunz | ||||
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| Keywords | disulfide ethylene diamine phthalocyanine coupling agent silicon chip copper leadframe epoxy adhesion promoter | ||||
| Dewey Decimal Classification | 500 Science > 540 Chemistry & allied sciences | ||||
| Status | Published | ||||
| Refereed | Yes, this version has been refereed | ||||
| Created at the University of Regensburg | Yes | ||||
| Item ID | 24968 |
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