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New adhesion promoters for copper leadframes and epoxy resin

Müller, Rainer, Heckmann, Klaus, Habermann, M., Paul, T. and Stratmann, M. (2000) New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion 72 (1), pp. 65-83.

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New primer mols. have been synthesized to increase the adhesion strength between a copper leadframe and an epoxy molding compd. in microelectronical devices. The coupling agents were preliminarily chemisorbed at the surface of copper plates via special binding groups like thiol, disulfide, ethylene diamine and phthalocyanine. Binding to the epoxy resin was performed via an hydroxyl group. ...


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Item type:Article
Institutions:Chemistry and Pharmacy > Institut für Physikalische und Theoretische Chemie > Chair of Chemistry VI - Physical Chemistry (Solution Chemistry) > Prof. Dr. Werner Kunz
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Keywords:disulfide ethylene diamine phthalocyanine coupling agent silicon chip copper leadframe epoxy adhesion promoter
Dewey Decimal Classification:500 Science > 540 Chemistry & allied sciences
Refereed:Yes, this version has been refereed
Created at the University of Regensburg:Yes
Item ID:24968
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