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New adhesion promoters for copper leadframes and epoxy resin

Müller, Rainer ; Heckmann, Klaus ; Habermann, M. ; Paul, T. ; Stratmann, M.



Abstract

New primer mols. have been synthesized to increase the adhesion strength between a copper leadframe and an epoxy molding compd. in microelectronical devices. The coupling agents were preliminarily chemisorbed at the surface of copper plates via special binding groups like thiol, disulfide, ethylene diamine and phthalocyanine. Binding to the epoxy resin was performed via an hydroxyl group. ...

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