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Device for in situ cleaving of hard crystals

URN to cite this document:
urn:nbn:de:bvb:355-epub-253185
Schmid, Martin ; Renner, Andreas ; Giessibl, Franz J.
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Date of publication of this fulltext: 10 Jul 2012 14:02


Abstract

Cleaving crystals in a vacuum chamber is a simple method for obtaining atomically flat and clean surfaces for materials with a preferential cleaving plane. Most in situ cleavers use parallel cutting edges that are applied from two sides on the sample. We found in ambient experiments that diagonal cutting pliers, where the cleavage force is introduced in a single point instead of a line, work very ...

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