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2018
Schaffus, T., Albert, P., Breuer, W., Debie, D., Graml, M., Hollerith, C., Kroninger, F., Mack, W., Pfaff, H., Schaffus, M. and Walter, J.
(2018)
Influence of sample preparation on intrinsic stresses inside a model Chip - First results of partial decapsulation.
Microelectronics Reliability 88-90, pp. 299-303.
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