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Publications by Pressel, Klaus
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Number of items: 2.
2018
Hagelauer, Amelie, Wojnowski, Maciej, Pressel, Klaus, Weigel, Robert and Kissinger, Dietmar
(2018)
Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies.
IEEE Microwave Magazine 19 (1), pp. 48-56.
Fulltext not available.
2016
Beck, Christopher, Ng, Herman, Agethen, Roman, PourMousavi, Mehran, Forstner, Hans, Wojnowski, Maciej, Pressel, Klaus, Weigel, Robert, Hagelauer, Amelie and Kissinger, Dietmar
(2016)
Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology.
IEEE Sensors Journal, p. 1.
Fulltext not available.
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