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Jump to: 2018 | 2016
Number of items: 2.

2018

Hagelauer, Amelie, Wojnowski, Maciej, Pressel, Klaus, Weigel, Robert and Kissinger, Dietmar (2018) Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies. IEEE Microwave Magazine 19 (1), pp. 48-56. Fulltext not available.

2016

Beck, Christopher, Ng, Herman, Agethen, Roman, PourMousavi, Mehran, Forstner, Hans, Wojnowski, Maciej, Pressel, Klaus, Weigel, Robert, Hagelauer, Amelie and Kissinger, Dietmar (2016) Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology. IEEE Sensors Journal, p. 1. Fulltext not available.

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